People >> Xiaoyong Miao
Xiaoyong Miao
4th Ph.D Student
e-mail：19112020100@fudan.edu.cn
Research Field：Package and design of sensors
Education & Work experience
2019.9-present Fudan University College of Microelectronics Ph.D student
2011.3-2019.9 Tong fu micro-electronic company engineer
2013.10-2016.3 WuHan University College of Microelectronics M.S.
2011.3-2019.9 Tong fu micro-electronic company engineer
2013.10-2016.3 WuHan University College of Microelectronics M.S.
Publications
1.Peisheng Liu;z, Guangming Fan, Xiaoyong Miao, and Xiaoyong Miao, Eect of aluminum trace dimension on electro-migration failure in flip-chip package, International Journal of Modern Physics B.Vol. 30 (2016) 1741002 (10 pages) © World Scientic Publishing Company
2.Linqi Liu, Qiang Liu, Xiaoyong Miao, Wei Jiang, Wei Lin, Lei Shi, 2018 19th International Conference on Electronic Packaging Technology.
2.Linqi Liu, Qiang Liu, Xiaoyong Miao, Wei Jiang, Wei Lin, Lei Shi, 2018 19th International Conference on Electronic Packaging Technology.