Back to previous
>> Xiaoyong Miao
2nd Ph.D Student
Research Field：Package and design of sensors
Education & Work experience
2019.9-present Fudan University College of Microelectronics Ph.D student
2011.3-2019.9 Tong fu micro-electronic company engineer
2013.10-2016.3 WuHan University College of Microelectronics M.S.
1.Peisheng Liu;z, Guangming Fan,
, and Xiaoyong Miao, Eect of aluminum trace dimension on electro-migration failure in flip-chip package,
International Journal of Modern Physics B.
Vol. 30 (2016) 1741002 (10 pages) © World Scientic Publishing Company
2.Linqi Liu, Qiang Liu,
, Wei Jiang, Wei Lin, Lei Shi, 2018 19th International Conference on Electronic Packaging Technology.