People >> Xiaoyong Miao
Xiaoyong Miao
4th Ph.D Student
Research Field:Package and design of sensors 
Education & Work experience
2019.9-present         Fudan University                                  College of Microelectronics                    Ph.D student
2011.3-2019.9          Tong fu  micro-electronic company                                                                     engineer
2013.10-2016.3        WuHan                                                 University College of Microelectronics   M.S.
 1.Peisheng Liu;z, Guangming Fan, Xiaoyong Miao, and Xiaoyong Miao, Eect of aluminum trace dimension on electro-migration failure in flip-chip package, International Journal of Modern Physics B.Vol. 30 (2016) 1741002 (10 pages) © World Scientic Publishing Company
2.Linqi Liu, Qiang Liu, Xiaoyong Miao, Wei Jiang, Wei Lin, Lei Shi, 2018 19th International Conference on Electronic Packaging Technology.